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| TSMC and the United States reached a manufacturing agreement IDT |
| Beijing time on August 7 morning news, according to foreign media reports, the U.S. semiconductor company IDT and TSMC announced Thursday the signing of the manufacturing agreement, IDT will be located in Oregon’s semiconductor plant manufacturing processes and products transferred to TSMC. The agreement is expected to complete the transfer of all products within two years, has received the consent of both the Company and the IDT Board of Directors.
Vice president of global manufacturing IDT Mike Hunt (Mike Hunter), said: "Over the past year, we have been gradually transformed into specially designed for communications, computer and consumer electronics markets to develop application-specific solutions, the company reached an agreement with TSMC let us. able to take full advantage of TSMC’s cutting-edge technology, is the inevitable transformation of the way our next step. this agreement will structure our systems expertise and technology platform combined with TSMC to expand our manufacturing capacity in the world, has officially opened the IDT from fab-lite model (fab-lite) the transition to a fabless manufacturing model (fabless) process. "
Agreement, IDT will be within the next two years, the United States is currently producing semiconductor plant in Oregon 0.13 micron manufacturing process and the products and transfer production to TSMC, as its process equipment and plant are not included. IDT plans to close this fab after the transfer is completed, and has hired a third party in the market for possible buyers.
IDT is headquartered in San Jose, California, was founded in 1980 to promote the development of the digital media experience, mixed-signal semiconductor solutions. The company’s focus is to provide intelligent power solutions, maximize equipment performance while optimizing system-level performance. IDT on the NASDAQ Global Select Market under the ticker symbol IDTI traded. | | |  |
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